ENGINEERING CAPABILITIES

Capabilities

Engineering across the complete system.

Many engineering problems do not belong to a single discipline. Electronics interact with controls. Sensors interact with software. Thermal performance affects electrical reliability. Mechanical design determines how everything fits together.

MIRRENO combines multiple engineering disciplines to solve application-level problems rather than treating each component in isolation.

CAPABILITY 01

Electronics

Electronic design, troubleshooting and integration for industrial and application-specific systems.

  • Analog and digital electronics
  • Power electronics and power conversion
  • PCB and electronic assembly integration
  • Interface and signal conditioning circuits
  • Electronic troubleshooting and failure analysis
  • Prototype development and functional testing
CAPABILITY 02

Industrial Controls

Control electronics and application logic for machines, equipment and industrial automation.

  • Motor and motion control
  • Application-specific control systems
  • Control panel and interface integration
  • Embedded control
  • Equipment retrofit and modernization
  • System sequencing and control logic
CAPABILITY 03

Sensing & Connectivity

Integrating real-world measurements, control inputs and communications into complete engineered systems.

  • Sensor selection and integration
  • Signal conditioning
  • Measurement and monitoring
  • CAN and RS485 communications
  • Digital and analog interfaces
  • Connected equipment and system interfaces
CAPABILITY 04

Specialty Light

Engineering and integration for specialized UV, IR and application-specific light systems used in industrial equipment and processes.

  • UV and infrared light systems
  • Specialty lamp integration
  • Light-source power electronics
  • Electrical and thermal integration
  • Application-specific light assemblies
  • Prototype and OEM system support
CAPABILITY 05

Thermal Systems

Thermal management integrated with the electrical and mechanical requirements of the complete system.

  • Electronic thermal management
  • Air and liquid cooling integration
  • Immersion cooling applications
  • Temperature sensing and monitoring
  • Thermal interface considerations
  • System-level thermal integration
CAPABILITY 06

Mechanical Integration

Bringing electronics, controls, sensors and thermal systems together in a practical physical assembly.

  • Enclosure and equipment integration
  • Component packaging
  • Electrical-mechanical interface design
  • Mounting and assembly considerations
  • Prototype integration
  • Manufacturing coordination
SYSTEM-LEVEL ENGINEERING

The value is often in the interfaces between technologies.

A successful product or equipment upgrade depends on more than selecting individual components. MIRRENO focuses on how electronics, controls, sensors, thermal management, mechanical systems and manufacturing requirements interact as one complete system.

Integrated Engineering

Depending on the application, a MIRRENO project can combine several technical disciplines into one coordinated solution.

Electronics
→
Controls
→
Sensing
→
Thermal
→
Mechanical
→
Manufacturing

Have a problem that crosses multiple disciplines?

Send us the application, requirements, drawings, photos or existing equipment information. MIRRENO can review the complete system and determine which engineering capabilities are needed.

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