Engineering across the complete system.
Many engineering problems do not belong to a single
discipline. Electronics interact with controls. Sensors
interact with software. Thermal performance affects
electrical reliability. Mechanical design determines how
everything fits together.
MIRRENO combines multiple engineering disciplines to solve
application-level problems rather than treating each
component in isolation.
CAPABILITY 01
Electronics
Electronic design, troubleshooting and integration for
industrial and application-specific systems.
- Analog and digital electronics
- Power electronics and power conversion
- PCB and electronic assembly integration
- Interface and signal conditioning circuits
- Electronic troubleshooting and failure analysis
- Prototype development and functional testing
CAPABILITY 02
Industrial Controls
Control electronics and application logic for machines,
equipment and industrial automation.
- Motor and motion control
- Application-specific control systems
- Control panel and interface integration
- Embedded control
- Equipment retrofit and modernization
- System sequencing and control logic
CAPABILITY 03
Sensing & Connectivity
Integrating real-world measurements, control inputs and
communications into complete engineered systems.
- Sensor selection and integration
- Signal conditioning
- Measurement and monitoring
- CAN and RS485 communications
- Digital and analog interfaces
- Connected equipment and system interfaces
CAPABILITY 04
Specialty Light
Engineering and integration for specialized UV, IR and
application-specific light systems used in industrial
equipment and processes.
- UV and infrared light systems
- Specialty lamp integration
- Light-source power electronics
- Electrical and thermal integration
- Application-specific light assemblies
- Prototype and OEM system support
CAPABILITY 05
Thermal Systems
Thermal management integrated with the electrical and
mechanical requirements of the complete system.
- Electronic thermal management
- Air and liquid cooling integration
- Immersion cooling applications
- Temperature sensing and monitoring
- Thermal interface considerations
- System-level thermal integration
CAPABILITY 06
Mechanical Integration
Bringing electronics, controls, sensors and thermal
systems together in a practical physical assembly.
- Enclosure and equipment integration
- Component packaging
- Electrical-mechanical interface design
- Mounting and assembly considerations
- Prototype integration
- Manufacturing coordination
SYSTEM-LEVEL ENGINEERING
The value is often in the interfaces between technologies.
A successful product or equipment upgrade depends on more
than selecting individual components. MIRRENO focuses on
how electronics, controls, sensors, thermal management,
mechanical systems and manufacturing requirements interact
as one complete system.
Integrated Engineering
Depending on the application, a MIRRENO project can combine
several technical disciplines into one coordinated solution.
Electronics
→
Controls
→
Sensing
→
Thermal
→
Mechanical
→
Manufacturing
Have a problem that crosses multiple disciplines?
Send us the application, requirements, drawings, photos or
existing equipment information. MIRRENO can review the
complete system and determine which engineering capabilities
are needed.
START A PROJECT →